News from National Electronics Week
Link Hamson to exhibit innovative products at NEW UK 2010.
Link Hamson, a long term supplier to the UK manufacturing industry of innovative production improvement solutions, will exhibit a number of different product lines at the National Electronics Week Exhibition, including the new KIC MVP verification thermal profiler.
KIC Thermal Profiling
Energy Savings are a feature of the KIC Explorer; a really compact thermal profiler using the KIC software to quickly find the best possible oven settings for a thermal profile within the process window and with the lowest energy requirement. KIC’s unique Process Window Index allows profiles to be compared and shows how good the best profile really is. Better Process Control is achieved using the KIC MVP, it produces a virtual profile of the PCB each time the MVP is passed through the oven, and there’s no need to use a board.
Filtronic Mobile Filter Systems
Filtronic’s products are characterised by a unique filter concept that eliminates gases, smoke and particles produced in diverse manufacturing processes. New to the Filtronic product line up is the MG200 with a suction capacity of 200m3/hr which is suitable for connection to up to four 60mm extraction arms or one CBCA air curtain cabinet. The MG200 is a mobile unit than can easily be moved between different work places; it has minimal service needs and a long filter life. The flexibility of the system, its independence from fixed installations and low running costs create a unit with very low cost of ownership.
Martin Reliable Rework Systems
The Martin Expert BGA rework system will be showing how quick and easy reliable BGA rework can be. It has been used extensively for mobile phone, Playstation and Xbox repairs. Reliable repairs of large boards is now possible with the new hybrid convection and IR underheater for a really even temperature distribution across the board. BGA reballing is carried out with the Martin Reball 03 equipment.
Labelling for Harsh Environments
Link Hamson specialises in small dimension labels for electronics assembly manufactured using the highest specification materials. Built to endure the extreme environmental conditions encountered in electronics assembly the labels are also used in many other harsh environment applications where durability and legibility are difficult to attain.
For further information please visit www.linkhamson.com
